 Wafer Laser Marking System IL 3000 PlusThe 3000 Plus series laser system is designed to mark 300 mm wafers. The IL 3000 Plus provides Deep or Debris Free marking with the possibility to mark on the front and/or backside of a 300 mm wafer simultaneously in a single process step. A unique InnoLas Semiconductor designed 300 mm vacuum or Edge Grip handling (including aligner) is available. Both handling systems allow front and/or backside marking capability. Download: Leaflet IL 3000 Plus (PDF 438 KB) |